JPH0134388Y2 - - Google Patents
Info
- Publication number
- JPH0134388Y2 JPH0134388Y2 JP4969482U JP4969482U JPH0134388Y2 JP H0134388 Y2 JPH0134388 Y2 JP H0134388Y2 JP 4969482 U JP4969482 U JP 4969482U JP 4969482 U JP4969482 U JP 4969482U JP H0134388 Y2 JPH0134388 Y2 JP H0134388Y2
- Authority
- JP
- Japan
- Prior art keywords
- enamel
- substrate
- metal core
- thick film
- mounting hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 210000003298 dental enamel Anatomy 0.000 claims description 27
- 239000000758 substrate Substances 0.000 claims description 13
- 239000002184 metal Substances 0.000 claims description 8
- 238000010304 firing Methods 0.000 claims description 5
- 238000007639 printing Methods 0.000 claims description 5
- 238000005516 engineering process Methods 0.000 claims description 2
- 239000004020 conductor Substances 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 2
- 238000004534 enameling Methods 0.000 description 2
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000035882 stress Effects 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4969482U JPS58153472U (ja) | 1982-04-06 | 1982-04-06 | ほうろう基板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4969482U JPS58153472U (ja) | 1982-04-06 | 1982-04-06 | ほうろう基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58153472U JPS58153472U (ja) | 1983-10-14 |
| JPH0134388Y2 true JPH0134388Y2 (en]) | 1989-10-19 |
Family
ID=30060534
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4969482U Granted JPS58153472U (ja) | 1982-04-06 | 1982-04-06 | ほうろう基板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58153472U (en]) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5285347B2 (ja) * | 2008-07-30 | 2013-09-11 | セミコンダクター・コンポーネンツ・インダストリーズ・リミテッド・ライアビリティ・カンパニー | 回路装置 |
-
1982
- 1982-04-06 JP JP4969482U patent/JPS58153472U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58153472U (ja) | 1983-10-14 |
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